Professional precision hardware and X-Ray testing
- Integrated circuit package inspection: to pick out layers peel off, break, empty space, circuit inside defects
- Printed circuit board inspection: to pick out circuit offset, short circuit, bridge
- SMD solder quality inspection: to pick out and measure the empty solder points
- Circuit inspection: to pick out open circuit, short circuit, abnormal connection problem
- BGA solder/ bonding quality inspection: device dimension measure, bonding line measure, tin immerse measure
Bubble Inside
Solder Bridge
Bubble Measurement
Insufficient Solder